Method and apparatus for bonding metals and composites

ABSTRACT

Apparatus, systems and methods for forming a structure that includes a metal and a composite material are disclosed. According to one aspect, a layer stack includes a metal layer with a first surface, the first surface including at least one protruding feature. The layer stack also includes a non-metal layer molded to the first surface of the metal layer, wherein the non-metal layer is molded over and/or around the at least one protruding feature.

CROSS-REFERENCE TO RELATED APPLICATION

This application is a divisional application of U.S. application Ser.No. 12/715,702, filed Mar. 2, 2010, and entitled “METHOD AND APPARATUSFOR BONDING METALS AND COMPOSITES,” which is hereby incorporated hereinby reference.

FIELD OF THE INVENTION

The present disclosure relates generally to assembly processes forcomponents that include different materials and, more particularly, tocreating components that include a metal and a composite material.

BACKGROUND OF THE INVENTION

Devices, e.g., small electronic devices, often include components thatare formed by assembling sections made from different materials. Metalis used in many devices, as for example portable media players and cellphones, because of the structural strength of metal and/or the aestheticqualities of metal. Thus, in many devices, it becomes necessary tocreate bonds between metal on materials such as composites.

When sections of components are formed from the same material, bondingthe sections is generally not difficult. However, when sections ofcomponents are formed from different materials, bonding sections becomesmore challenging. For example, bonding a metal section to a sectionformed from a composite material such as a hard plastic is difficult toaccomplish especially when there are space constraints. In other words,creating a joint between a metal piece and a plastic piece that providesa desired bond strength and substantially minimizes the size of thejoint is difficult. Often, joints are larger than desired andeffectively become macro features of a component, as achieving a desiredbond strength may require relatively large joints.

Therefore, what is desired is a method and an apparatus for achieving arelatively strong bond between components of different materials. Morespecifically, what is needed is a method and an apparatus for creating arelatively strong joint between a metal part and a part formed from acomposite material.

SUMMARY

The invention pertains to apparatus, systems and methods for providingfacilitating bonding between a metal part and a composite part.

The invention may be implemented in numerous ways, including, but notlimited to including, as a method, system, device, or apparatus(including computer readable medium). Several embodiments of theinvention are discussed below.

According to one aspect, a layer stack includes a metal layer with afirst surface, the first surface including at least one protrudingfeature. The layer stack also includes a non-metal layer molded to thefirst surface of the metal layer, wherein the non-metal layer is moldedover and/or around the at least one protruding feature. In oneembodiment, the at least one protruding feature is a flange machinedonto the metal layer. In another embodiment, the at least one protrudingfeature is formed by adding a wire bond or a solder ball to the metallayer. In still another embodiment, the non-metal layer is athermoplastic layer.

According to another aspect, an assembly includes a substratearrangement and a non-metal layer. The substrate arrangement includes ametal substrate and a prongle component. The prongle component includesat least one protruding feature. The non-metal layer is formed over theprotruding feature, and the non-metal layer engages the protrudingfeature.

In accordance with yet another aspect, an electronic device includes abezel and a composite component. The bezel is formed from a metalmaterial, and includes at least one flange with a first surface. Thefirst surface has at least one protruding feature formed thereon andextending therefrom. The composite component is formed over theprotruding feature and the flange. The composite component engages theat least one protruding feature and the flange to engage the bezel. Inone embodiment, the protruding feature is a wire or a solder ball.

According to still another aspect, a method for bonding a compositematerial to a metal material includes obtaining a metal substrate andobtaining a prongle piece that has at least one protruding feature. Themethod also includes bonding the prongle piece to the metal substrateand forming a composite piece over the protruding feature to bond thecomposite piece with the at least one protruding feature. In oneembodiment, the metal substrate includes a flange, and bonding theprongle piece to the metal substrate includes bonding the prongle pieceto the flange.

In accordance with another aspect, a method for bonding a compositematerial to a metal material includes obtaining a metal substrate andforming a plated surface on the metal substrate. The plated surfaceincludes at least one plated feature. The method also includes forming aprongle piece over the plated surface. The prongle piece has at leastone protruding feature that is formed over the at least one platedfeature. A composite piece is formed over the protruding feature to bondthe composite piece with the protruding feature.

Other aspects and advantages will become apparent from the followingdetailed description taken in conjunction with the accompanying drawingswhich illustrate, by way of example, the principles of the invention.

BRIEF DESCRIPTION OF THE DRAWINGS

The accompanying drawings, which are incorporated into and constitute apart of this specification, illustrate one or more example embodimentsand, together with the description of example embodiments, serve toexplain the principles and implementations associated with thespecification.

FIG. 1A is a diagrammatic representation of a substrate assembly, e.g.,a metal substrate assembly, in accordance with one embodiment.

FIG. 1B is a diagrammatic representation of an overall assembly thatincludes a substrate assembly, e.g., substrate assembly 104 of FIG. 1A,and a composite piece bonded to a prongle piece of the substrateassembly in accordance with one embodiment.

FIG. 2 is a diagrammatic representation of a substrate assembly, e.g., ametal substrate assembly, that includes a prongle piece bonded to asubstrate in accordance with one embodiment.

FIG. 3 is a diagrammatic representation of a substrate assembly, e.g., ametal substrate assembly, that includes a prongle piece formed onto asubstrate in accordance with one embodiment.

FIG. 4 is a process flow diagram which illustrates a first method offorming a substrate assembly that include prongles in accordance withone embodiment.

FIG. 5 is a process flow diagram which illustrates a second method offorming a substrate assembly that include prongles in accordance withone embodiment.

FIG. 6 is a diagrammatic representation of a joint formed between ametal piece, which includes prongles on one surface, and a compositepiece in accordance with one embodiment.

FIG. 7 is a diagrammatic representation of a joint formed between ametal piece, which includes prongles on a plurality of surfaces, and acomposite piece in accordance with one embodiment.

FIG. 8 is a diagrammatic representation of a joint formed between ametal piece, which includes prongles that are individually bonded to themetal piece, and a composite piece in accordance with one embodiment.

FIG. 9 is a diagrammatic perspective representation of a device whichincludes a metal piece with prongles and a composite piece that isbonded to the metal piece through the prongles in accordance with oneembodiment.

DETAILED DESCRIPTION OF EXAMPLE EMBODIMENTS

The invention pertains to apparatus, systems and methods for providing abond between parts formed from different materials. In one embodiment, abond may be formed between a metal piece and a piece formed from acomposite material, i.e., a composite piece, by providing protrusions onthe metal piece to which the composite piece may be bonded. Theprotrusions, e.g., protruding features or prongles, may be formed from amaterial that is easier to bond to the metal piece than the compositematerial, and the composite piece may be bonded to the protrusions. Bysizing the prongles to provide a significant amount of surface area, arelatively strong bond between the composite piece and the prongles and,hence, the metal piece, may effectively be promoted. The prongles enablea relatively strong joint between the overall metal piece, i.e., themetal piece and the prongles, and a composite piece to be formed.

An overall assembly, or a layer stack, may generally include a metallayer with a surface with at least one prongle. The layer stack may alsoinclude a non-metal layer, e.g., a layer formed from a compositematerial such as a thermoplastic or a hard plastic, that issubstantially molded to the surface of the metal layer with the pronglesuch that the composite material essentially interlocks with theprongle. In other words, a layer formed from a non-metal such as acomposite is molded around or otherwise bonded to the prongle.

The configuration of a prongle may vary depending upon the requirementsof a device in which the prongle is included. A prongle may be a flange,protuberance, protruding feature, or projection machined onto a metalpart. It should be appreciated, however, that a prongle may instead be aflange or the like formed on the metal part, e.g., through a platingprocess, or a flange or the like that is bonded to the metal part, e.g.,through a wire bond or solder process.

In general, prongles are sized to provide a surface to which a compositematerial may be bonded. The size, e.g., dimensions, of prongles may bedependent upon a variety of factors including, but not limited toincluding, the size of the parts on which the prongles are essentiallybonded and the materials from which the parts are made. Prongles may, inone embodiment, effectively be wire pieces that are bonded, e.g.,soldered, to a surface of a substrate. In another embodiment, pronglesmay be solder balls which are soldered onto a surface of a substrate.

The apparatus, systems, and methods of the invention allow for theformation of prongles, as well as to the assembly of a component thatincludes the prongles and a composite part bonded to the prongles. Inone embodiment, prongles may be included on a metal bezel, and acomposite part may be bonded to the metal bezel. A metal part such as abezel with prongles and a composite part that is bonded to the metalpart through the prongles may be included in small form factorelectronic devices such as handheld electronic devices, as for examplemobile phones, media players, user input devices (e.g., mouse, touchsensitive devices), personal digital assistants, remote controls, etc.The apparatus, systems, and methods may also be used with relativelylarger form factor electronic devices such as portable computers, tabletcomputers, displays, monitors, televisions, etc.

Embodiments are described herein in the context of forming prongles on ametal part and bonding a composite part to the prongles and, thus,effectively bonding the composite part to the metal part. The followingdetailed description is illustrative only, and is not intended to be inany way limiting. Other embodiments will readily suggest themselves toskilled persons having the benefit of this disclosure. Reference willnow be made in detail to implementations as illustrated in theaccompanying drawings. The same reference indicators will generally beused throughout the drawings and the following detailed description torefer to the same or like parts.

In the interest of clarity, not all of the routine features of theimplementations described herein are shown and described. It will, ofcourse, be appreciated that in the development of any such actualimplementation, numerous implementation-specific decisions must be madein order to achieve the developer's specific goals, such as compliancewith application and business related constraints, and that thesespecific goals will vary from one implementation to another and from onedeveloper to another. Moreover, it will be appreciated that such adevelopment effort might be complex and time-consuming, but wouldnevertheless be a routine undertaking of engineering for those ofordinary skill in the art having the benefit of this disclosure.

Referring initially to FIG. 1A, a substrate assembly, e.g., a metalsubstrate assembly or arrangement, which includes prongles will bedescribed in accordance with an embodiment of the invention. In oneembodiment, a substrate assembly 104 may include a substrate 108 and aprongle piece 112 that is bonded to, or otherwise coupled to, substrate108. Substrate 108 is typically formed from metal. Prongle piece 112 maybe formed from substantially any material that may maintain a relativelystrong bond with substrate 108 on a first surface 109. By way ofexample, prongle piece 112 may be formed from any suitable materialwhich forms a stronger bond with substrate 108 than substrate 108 wouldlikely form with a composite material (not shown). Although pronglepiece 112 may be formed from metal, prongle piece 112 is not limited tobeing formed from metal.

Prongle piece 112 generally includes at least one prongle 116 on asecond surface 111. Although prongles 116 are illustrated as beingintegrally formed as a part of prongle piece 112, it should beappreciated that prongles 116 are not limited to being integrally formedas part of prongle piece 112. In one embodiment, prongle piece 112 mayeffectively be a single prongle 116. That is, prongle piece 112 mayessentially comprise a single prongle.

Prongle piece 112 is arranged to effectively bond to or otherwiseengaged with a composite material (not shown). Prongle piece 112 or,more specifically, prongles 116 on prongle piece 112 provide surfaces towhich a composite material (not shown) may bond. Through prongle piece112, such a composite material (not shown) may bond to substrateassembly 104. FIG. 1B is a diagrammatic representation of an overallassembly that includes substrate assembly 104 and a composite piecebonded to prongle piece 120 of the substrate assembly in accordance withan embodiment of the invention. An overall assembly 100 includes acomposite piece 120 that is essentially formed over, or molded overand/or around, prongle piece 112. Composite piece 120 bonds with pronglepiece 112 such that composite piece 120 interlocks with prongle piece112.

Because prongle piece 112 includes prongles 116 which provide a largersurface area or mechanical interlock for bonding than substrate 108, thebond between composite piece 120 and prongle piece 112 is generallyrelatively strong. Further, prongle piece 112 may be formed from amaterial that is more conducive to the formation of a strong bondbetween composite piece 120 and prongle piece 112 than the material fromwhich substrate 108 is formed.

A substrate piece may include a prongle piece that is integral with asubstrate. Alternatively, however, a prongle piece such as prongle piece112 of FIGS. 1A and 1B may be substantially bonded on a substrate, e.g.,substrate 108, to create a substrate assembly, e.g., substrate assembly104. For instance, a separate, substantially pre-formed prongle piecemay be bonded to a substrate in order to form a substrate assembly, or aprongle piece may effectively be molded onto a substrate.

FIG. 2 is a diagrammatic representation of a substrate assembly, e.g., ametal substrate assembly, that includes a separate, substantiallypre-formed prongle piece bonded to a substrate in accordance with anembodiment of the invention. A substrate assembly 204 includes asubstrate 208 which, in the described embodiment, may be a metalsubstrate or layer. A prongle piece 212, which includes at least oneprongle 216 or protruding feature, may be bonded to substrate 208 by abonding layer 224.

Bonding layer 224 may be an adhesive layer which effectively affixesprongle piece 212 to substrate 208. In lieu of being an adhesive layer,bonding layer 224 may instead be formed by substantially fusing pronglepiece 212 to substrate 208. By way of example, a bottom surface ofprongle piece 212 and a top surface of substrate 208 may be heated andthen pressed together such that bonding layer 224 is formed.

FIG. 3 is a diagrammatic representation of a substrate assembly, e.g., ametal substrate assembly, that includes a prongle piece that iseffectively molded onto a substrate in accordance with an embodiment ofthe invention. A substrate assembly 304 includes a substrate 308, e.g.,a metal substrate, onto which a layer of features 328 are formed.Feature layer 328 may be molded onto substrate 308, and may effectivelyprovide a template for the formation of a prongle piece 312. Pronglepiece 312, which includes at least one prongle 316 may be overmoldedonto feature layer 328. A mold (not shown) may be placed over featurelayer 328, and a material such as metal may be introduced into the moldsuch that prongle piece 312 may be created.

In general, as previously mentioned, prongles may be substantiallyintegral to substrate. That is, prongles may effectively be machinedonto a metal substrate. For example, etching processes may be used tocreate prongles on of a metal substrate. However, as discussed above,prongles may instead be associated with an external structure that isbonded to a surface of a metal substrate, or may be otherwise created ona surface of a metal substrate. With reference to FIGS. 4 and 5, methodsof bonding prongles to the surface of a metal substrate and otherwisecreating prongles on a surface of a metal substrate will be described,respectively.

FIG. 4 is a process flow diagram which illustrates a method of forming asubstrate assembly, e.g., substrate assembly 204 of FIG. 2, that includeprongles in accordance with an embodiment of the invention. A method 401of forming a substrate assembly that includes prongles begins at step405 in which a metal substrate is obtained. The metal substrate may be ametal bezel suitable for use as part of a portable electronic device ora cellular phone device. In one embodiment, the metal substrate may beconfigured such that the metal substrate includes a flange.

After the metal substrate is obtained, a prongle piece is then obtainedin step 409. The prongle piece may be a structure that includes aplurality of prongles or the prongle piece may be a structure that iseffectively a single prongle. When the prongle piece is a structure thatincludes a plurality of prongles, the prongle piece may include asubstrate that supports the plurality of prongles. The prongle piece maybe formed from metal, e.g., the same metal that forms the metalsubstrate. It should be appreciated, however, that the prongle piece isnot limited to being formed from metal, and may generally be formed fromsubstantially any material which is relatively easily bonded to, and mayform a relatively strong bond with, the metal substrate. A prongle piecemay be formed, for example, from adhesive materials such as epoxy. Ingeneral, prongle piece may be formed from any material which bonds moreeasily to the metal substrate than a composite material, i.e., thecomposite material from which a composite piece that is to be moldedover the prongle piece is formed.

Once the prongle piece is obtained, the prongle piece is bonded to themetal substrate in step 413. Bonding the prongle piece to the metalsubstrate may include, but is not limited to including, essentiallygluing the prongle piece to the metal substrate using an adhesivematerial, soldering the prongle piece to the metal substrate, andheating the prongle piece and/or the metal substrate to effectively fusethe prongle piece to the metal substrate.

In step 417, a composite piece may be formed over the prongle piece,e.g., to create an overall structure. The composite piece may be formedover the prongle piece such that the composite piece bonds with theprongles on the prongle piece. When the metal substrate is a bezel of adevice, the composite piece may be a thermoplastic piece that isarranged to effectively be bonded to the bezel. The method of forming asubstrate assembly is completed after the prongle piece is bonded to themetal substrate or, if an overall structure that includes the substrateassembly is formed, the method is completed after the composite materialis formed over the prongle piece.

FIG. 5 is a process flow diagram which illustrates a second method offorming a substrate assembly, e.g., substrate assembly 304 of FIG. 3,that include prongles in accordance with an embodiment of the invention.A method 501 of forming a substrate assembly begins at step 505 in whicha metal substrate is obtained. Once the metal substrate is obtained, aplated surface with features is formed on the metal substrate in step509. The plated surface, e.g., an electroformed surface, may be formedusing a mold. As will be appreciated by those skilled in the art,electroforming allows parts to be made by plating electroformedmaterial, e.g., nickel or copper, onto surfaces. The features in theplated surface are typically configured to enable prongles to be formedthereon.

After the plated surface is formed on the metal substrate, a pronglepiece which includes at least one prongle extending therefrom is formedover the plated surface in step 513. In one embodiment, a compositepiece may be formed over the prongle piece, e.g., to create an overallstructure, in step 517. The composite piece may be formed over theprongle piece such that the composite piece bonds with the prongles onthe prongle piece. When the metal substrate is a bezel of a device, thecomposite piece may be a thermoplastic piece that is arranged toeffectively be bonded to the bezel. The method of forming a substrateassembly is completed after the prongle piece is bonded to the metalsubstrate or, if an overall structure that includes the substrateassembly is formed as discussed with respect to step 517, the method iscompleted after the composite material is formed over the prongle piece.

As previously mentioned, a metal substrate may include a flange. Aflange may be arranged to be a part of a lap joint, or an overlappingjoint, such that the flange effectively interlocks with a compositepiece to form a lap joint. Prongles may be formed on a surface of theflange to facilitate the interlocking of metal substrate to thecomposite piece. FIG. 6 is a diagrammatic representation of a joint,e.g., a lap joint, formed between a metal substrate assembly, whichincludes a flange with prongles on one surface, and a composite piece inaccordance with an embodiment of the invention. A joint is formed toeffectively bond a metal substrate assembly 604 and a composite piece620. The joint, as shown, may be a lap joint in that a portion ofcomposite piece 620 effectively overlaps a flange portion 632 of metalsubstrate assembly 604.

Prongles 616 are present on a surface of flange portion 632. Prongles616 may be bonded to flange portion 632, or otherwise formed on asurface of flange portion 632, as for example using the method describedabove with respect to FIG. 5. Alternatively, prongles 616 may besubstantially machined onto flange portion 632.

The number of prongles 616, as well as the size and shape of prongles616, may vary widely. In general, prongles 616 have a height thatextends from a top surface of flange portion 632 to approximately a topof metal substrate assembly 604. For example, the height of prongles 616may be approximately 0.2 millimeters (mm), and the height of flangeportion 632 as measured from a bottom surface to a surface at whichprongles 616 substantially begin may be approximately 0.2 mm. Theoverall height of metal substrate assembly 604 may be approximately 0.5mm. In one embodiment, the length of flange portion 632 may beapproximately 3.0 mm.

It should be appreciated, however, that the relative heights of prongles616, flange portion 632, and metal substrate assembly 604 may varywidely. By way of example, prongles may have a height of approximately0.125 mm while flange portion 632 has a height of approximately 0.25 mmand metal substrate assembly 604 has an overall height of approximately0.5 mm.

When a metal substrate assembly includes a flange, prongles are notlimited to being formed on a single surface of the flange. By way ofexample, prongles may be formed on a top surface of a flange as well ason a bottom surface of the flange. FIG. 7 is a diagrammaticrepresentation of a joint formed between a metal substrate assembly,which includes a flange portion with prongles on a plurality ofsurfaces, and a composite piece in accordance with an embodiment of theinvention. A joint, e.g., a lap joint, is formed to effectively bond ametal substrate assembly 704 and a composite piece 720. In theembodiment as shown, the joint includes a flange portion 732 of metalsubstrate assembly 704 and a portion of composite piece 720.

Prongles 716 are present on a top surface and a bottom surface of flangeportion 732. Prongles 716 may be substantially integral with flangeportion 732, e.g., machined onto flange portion 732, bonded to flangeportion 732, or otherwise formed on flange portion 732.

In one embodiment, prongles may be formed from individual pieces of wirethat are bonded, as for example through wire bonding or soldering, to asurface of a metal substrate. Referring next to FIG. 8, a joint formedbetween a metal substrate assembly, which includes prongles that areindividual wires bonded to the metal substrate assembly, and a compositepiece will be described in accordance with an embodiment of theinvention. A joint, which may be a lap joint, is effectively formed as ajunction between a metal substrate assembly 804 and a composite piece820. The joint may include, as shown, a flange portion 832 of metalsubstrate assembly 804 and a portion of composite piece 820.

Prongles 816, in one embodiment, may be formed from lengths of wire thatare joined to at least one surface of flange portion 832. As shown,solder joints 834 effectively couple prongles 816 to two surfaces offlange portion 832. It should be appreciated that a solder joint 834 anda length of wire may, together, be considered as an overall prongle 816.

As previously mentioned, prongles may be used to efficiently join ametal frame to a composite piece, e.g., a plastic piece, in a portableelectronic device. For example, an electronic device may include a metalframe that is to be interfaced with a composite piece. FIG. 9 is adiagrammatic perspective representation of a device which includes ametal piece with prongles and a composite piece that is bonded to themetal piece through the prongles in accordance with an embodiment of theinvention. A device 900 includes metal bezel pieces 904 a, 904 b, aswell as a composite piece 920. Composite piece 920 is configured tosubstantially interlock with prongles 916 formed on surfaces of metalbezel pieces 904 a, 904 b. In one embodiment, composite piece 920 isarranged to be molded or otherwise formed over prongles 916 such thatcomposite piece 920 is essentially joined with both metal bezel piece904 a and metal bezel piece 904 b.

When prongles 916 are included in metal bezel pieces 904 a, 904 b, thejoint formed by joining composite piece 920 to bezel piece 904 a and thejoint formed by joining composite piece 920 to bezel piece 904 b arerelatively strong due, at least in part, to the amount of surface areaassociated with the bonds associated with the joints. Further, as shown,composite piece 920 is bonded to metal bezel pieces 904 a, 904 b withinthe thickness of metal bezel pieces 904 a, 904 b. Bonding compositepiece 920 to metal bezel pieces 904 a, 904 b within the thickness ofmetal bezel pieces 904 a, 904 b allows joints that are formed to occupysubstantially no internal volume of device 900 and substantially noexternal volume of device 900. Although only a few embodiments of theinvention have been described, it should be understood that theinvention may be embodied in many other specific forms without departingfrom the spirit or the scope of the invention. By way of example, thesize and shape of prongles, as well as the number of prongles formed ona substrate, may vary widely. A prongle may be, in one embodiment, aball of solder provided on a substrate. In general, the size, shape, andnumber of prongles may be dependent on a number of factors including,but not limited to including, the size of an assembly that includes ametal piece bonded to a composite piece.

While a metal substrate with prongles has been described as being ametal bezel of an electronic device such s a portable electronic device,and a composite piece has been described as a thermoplastic piece of thedevice that is to be bonded to the metal bezel, it should be appreciatedthat a metal substrate with prongles is not limited to being a part ofan electronic device. Prongles may generally be used to efficiently jointwo different pieces in any device or structure.

A composite piece or layer has been described as molded over orinterlocked with prongles of a substrate assembly. When the compositepiece is molded over or interlocked with prongles, composite piece iseffectively formed over and around prongles, as shown for example inFIG. 1A. Generally, a composite piece may be cast over and around,shaped over and around, sculpted over and around, and/or positioned overand around prongles.

In general, the steps associated with the methods of the invention mayvary widely. Steps may be added, removed, altered, combined, andreordered without departing from the spirit or the scope of theinvention.

The various aspects, features, embodiments or implementations of theinvention described above may be used alone or in various combinations.

While this specification contains many specifics, these should not beconstrued as limitations on the scope of the disclosure or of what maybe claimed, but rather as descriptions of features specific toparticular embodiment of the disclosure. Certain features that aredescribed in the context of separate embodiments may also be implementedin combination. Conversely, various features that are described in thecontext of a single embodiment may also be implemented in multipleembodiments separately or in any suitable subcombination. Moreover,although features may be described above as acting in certaincombinations, one or more features from a claimed combination can insome cases be excised from the combination, and the claimed combinationmay be directed to a subcombination or variation of a subcombination.

In one embodiment, the components, process steps, and/or data structuresmay be implemented using various types of operating systems, computingplatforms, computer programs, and/or general purpose machines. Inaddition, those of ordinary skill in the art will recognize that devicesof a less general purpose nature, such as hardwired devices, fieldprogrammable gate arrays (FPGAs), application specific integratedcircuits (ASICs), or the like, may also be used without departing fromthe scope and spirit of the inventive concepts disclosed herein.

While embodiments and applications have been shown and described, itwould be apparent to those skilled in the art having the benefit of thisdisclosure that many more modifications than mentioned above arepossible without departing from the inventive concepts herein.

What is claimed is:
 1. An electronic device comprising: a bezel, thebezel being formed from a material, the bezel including at least oneflange with a first surface; a feature layer coupled to the bezel andover the at least one flange, the feature layer having a second surfacewith at least one protruding feature thereon and extending therefrom;and a composite component, the composite component being formed over theat least one protruding feature, wherein the composite component engagesthe at least one protruding feature to engage the bezel, wherein the atleast one protruding feature has a base portion coupled to the secondsurface of the feature layer and an extended portion extending from thesecond surface of the feature layer, a width of the at least oneprotruding feature being wider at a base portion than along an extendedportion.
 2. The electronic device of claim 1, wherein the compositecomponent is a thermoplastic component.
 3. The electronic device ofclaim 1, wherein the at least one flange has a configuration to enhancecoupling of the feature layer thereto.
 4. The electronic device of claim1, wherein the feature layer is bonded to the flange.
 5. The electronicdevice of claim 3, wherein the feature layer is bonded to the flange bybeing molded onto the flange.
 6. The electronic device of claim 1,wherein the flange includes a wire bond.
 7. The electronic device ofclaim 1, wherein the flange includes a solder ball.
 8. The electronicdevice of claim 1, wherein the composite component is molded over the atleast one protruding feature.
 9. The electronic device of claim 8,wherein the composite component engages the at least one protrudingfeature to engage the bezel.
 10. The electronic device of claim 1,wherein the bezel is formed from a metal material.
 11. An electronicdevice, comprising: a bezel arrangement, the bezel arrangementincluding: a metal substrate; and a feature layer, the feature layerhaving a first base surface and a second base surface, the first basesurface coupled to a top surface of the metal substrate, the second basesurface including at least one protruding feature integral with thelayer; and a non-metal layer, the non-metal layer being formed over theat least one protruding feature, wherein the non-metal layer engages theat least one protruding feature, and wherein the at least one protrudingfeature comprises a wire or a solder ball.
 12. The electronic device ofclaim 11, wherein the non-metal layer formed over the at least oneprotruding feature is molded over the at least one protruding feature.13. The electronic device of claim 11, wherein the feature layer ismolded onto or bonded to the metal substrate.
 14. The electronic deviceof claim 11, wherein the feature layer is formed from a metal materialand the non-metal layer is a composite layer.
 15. The electronic deviceof claim 11, wherein the composite layer is formed from a thermoplasticmaterial.
 16. The electronic device of claim 11, wherein the at leastone protruding feature comprises a wire.
 17. The electronic device ofclaim 11, wherein the at least one protruding feature comprises a solderball.
 18. An electronic device comprising: a bezel, the bezel beingformed from a material; a feature layer secured to the bezel, thefeature layer having a second surface with at least one protrudingfeature thereon and extending therefrom; and a composite component, thecomposite component being formed over the at least one protrudingfeature, wherein the composite component engages the at least oneprotruding feature to engage the bezel, wherein the at least oneprotruding feature has a base portion coupled to the second surface ofthe feature layer and an extended portion extending from the secondsurface of the feature layer, a width of the at least one protrudingfeature being wider at a base portion than along an extended portion.19. The electronic device of claim 18, wherein the feature layer isbonded to the bezel.
 20. The electronic device of claim 18, wherein thecomposite component is a thermoplastic component.
 21. The electronicdevice of claim 18, wherein the composite component is molded over theat least one protruding feature.